Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
ພ.ພ. 2015 · Woodhead Publishing
ປຶ້ມອີບຸກ
482
ໜ້າ
family_home
ມີສິດ
info
reportບໍ່ໄດ້ຢັ້ງຢືນການຈັດອັນດັບ ແລະ ຄຳຕິຊົມ ສຶກສາເພີ່ມເຕີມ
ກ່ຽວກັບປຶ້ມ e-book ນີ້
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study
ກ່ຽວກັບຜູ້ຂຽນ
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia
ໃຫ້ຄະແນນ e-book ນີ້
ບອກພວກເຮົາວ່າທ່ານຄິດແນວໃດ.
ອ່ານຂໍ້ມູນຂ່າວສານ
ສະມາດໂຟນ ແລະ ແທັບເລັດ
ຕິດຕັ້ງ ແອັບ Google Play Books ສຳລັບ Android ແລະ iPad/iPhone. ມັນຊິ້ງຂໍ້ມູນໂດຍອັດຕະໂນມັດກັບບັນຊີຂອງທ່ານ ແລະ ອະນຸຍາດໃຫ້ທ່ານອ່ານທາງອອນລາຍ ຫຼື ແບບອອບລາຍໄດ້ ບໍ່ວ່າທ່ານຈະຢູ່ໃສ.
ແລັບທັອບ ແລະ ຄອມພິວເຕີ
ທ່ານສາມາດຟັງປຶ້ມສຽງທີ່ຊື້ໃນ Google Play ໂດຍໃຊ້ໂປຣແກຣມທ່ອງເວັບຂອງຄອມພິວເຕີຂອງທ່ານໄດ້.
eReaders ແລະອຸປະກອນອື່ນໆ
ເພື່ອອ່ານໃນອຸປະກອນ e-ink ເຊັ່ນ: Kobo eReader, ທ່ານຈຳເປັນຕ້ອງດາວໂຫຼດໄຟລ໌ ແລະ ໂອນຍ້າຍມັນໄປໃສ່ອຸປະກອນຂອງທ່ານກ່ອນ. ປະຕິບັດຕາມຄຳແນະນຳລະອຽດຂອງ ສູນຊ່ວຍເຫຼືອ ເພື່ອໂອນຍ້າຍໄຟລ໌ໄໃສ່ eReader ທີ່ຮອງຮັບ.
