Mechanical Aspects in Electronics Systems Design
Ago 2014 · GRIN Verlag
5.0star
Maoni mojareport
Kitabu pepe
31
Kurasa
family_home
Kimetimiza masharti
info
reportUkadiriaji na maoni hayajahakikishwa Pata Maelezo Zaidi
Kuhusu kitabu pepe hiki
Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.
Ukadiriaji na maoni
5.0
Maoni moja
Kadiria kitabu pepe hiki
Tupe maoni yako.
Kusoma maelezo
Simu mahiri na kompyuta vibao
Sakinisha programu ya Vitabu vya Google Play kwa ajili ya Android na iPad au iPhone. Itasawazishwa kiotomatiki kwenye akaunti yako na kukuruhusu usome vitabu mtandaoni au nje ya mtandao popote ulipo.
Kompyuta za kupakata na kompyuta
Unaweza kusikiliza vitabu vilivyonunuliwa kwenye Google Play wakati unatumia kivinjari cha kompyuta yako.
Visomaji pepe na vifaa vingine
Ili usome kwenye vifaa vya wino pepe kama vile visomaji vya vitabu pepe vya Kobo, utahitaji kupakua faili kisha ulihamishie kwenye kifaa chako. Fuatilia maagizo ya kina ya Kituo cha Usaidizi ili uhamishe faili kwenye visomaji vya vitabu pepe vinavyotumika.
