High-Frequency Characterization of Electronic Packaging

· Electronic Packaging and Interconnects መጽሐፍ 1 · Springer Science & Business Media
ኢ-መጽሐፍ
158
ገጾች
የተሰጡት ደረጃዎች እና ግምገማዎች የተረጋገጡ አይደሉም  የበለጠ ለመረዳት

ስለዚህ ኢ-መጽሐፍ

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

ለዚህ ኢ-መጽሐፍ ደረጃ ይስጡ

ምን እንደሚያስቡ ይንገሩን።

የንባብ መረጃ

ዘመናዊ ስልኮች እና ጡባዊዎች
የGoogle Play መጽሐፍት መተግበሪያውንAndroid እና iPad/iPhone ያውርዱ። ከእርስዎ መለያ ጋር በራስሰር ይመሳሰላል እና ባሉበት የትም ቦታ በመስመር ላይ እና ከመስመር ውጭ እንዲያነቡ ያስችልዎታል።
ላፕቶፖች እና ኮምፒውተሮች
የኮምፒውተርዎን ድር አሳሽ ተጠቅመው በGoogle Play ላይ የተገዙ ኦዲዮ መጽሐፍትን ማዳመጥ ይችላሉ።
ኢሪደሮች እና ሌሎች መሳሪያዎች
እንደ Kobo ኢ-አንባቢዎች ባሉ ኢ-ቀለም መሣሪያዎች ላይ ለማንበብ ፋይል አውርደው ወደ መሣሪያዎ ማስተላለፍ ይኖርብዎታል። ፋይሎቹን ወደሚደገፉ ኢ-አንባቢዎች ለማስተላለፍ ዝርዝር የእገዛ ማዕከል መመሪያዎቹን ይከተሉ።