Emerging Food Packaging Technologies: Principles and Practice

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· Elsevier
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Par šo e-grāmatu

The successful employment of food packaging can greatly improve product safety and quality, making the area a key concern to the food processing industry. Emerging food packaging technologies reviews advances in packaging materials, the design and implementation of smart packaging techniques, and developments in response to growing concerns about packaging sustainability.Part one of Emerging food packaging technologies focuses on developments in active packaging, reviewing controlled release packaging, active antimicrobials and nanocomposites in packaging, and edible chitosan coatings. Part two goes on to consider intelligent packaging and how advances in the consumer/packaging interface can improve food safety and quality. Developments in packaging material are analysed in part three, with nanocomposites, emerging coating technologies, light-protective and non-thermal process packaging discussed, alongside a consideration of the safety of plastics as food packaging materials. Finally, part four explores the use of eco-design, life cycle assessment, and the utilisation of bio-based polymers in the production of smarter, environmentally-compatible packaging.With its distinguished editors and international team of expert contributors, Emerging food packaging technologies is an indispensable reference work for all those responsible for the design, production and use of food and beverage packaging, as well as a key source for researchers in this area. - Reviews advances in packaging materials, the design and implementation of smart packaging techniques, and developments in response to growing concerns about packaging sustainability - Considers intelligent packaging and how advances in the consumer/packaging interface can improve food safety and quality - Examines developments in packaging materials, nanocomposites, emerging coating technologies, light-protective and non-thermal process packaging and the safety of plastics as food packaging materials

Par autoru

Kit L. Yam is a Professor in Department of Food Science at Rutgers University.

Dong Sun Lee is a Professor at the Department of Food Science and Biotechnology at Kyungnam University, South Korea. Both are noted for their research on food packaging.

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