Components, Packaging and Manufacturing Technology
Yanwen Wu
ΡΠ½Π². 2011β―Π³. Β· Trans Tech Publications Ltd
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Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
ΠΡΠ΅Π½ΠΈΡΠ΅ ΡΠ»Π΅ΠΊΡΡΠΎΠ½Π½ΡΡ ΠΊΠ½ΠΈΠ³Ρ
ΠΠΎΠ΄Π΅Π»ΠΈΡΠ΅ΡΡ Ρ Π½Π°ΠΌΠΈ ΡΠ²ΠΎΠΈΠΌ ΠΌΠ½Π΅Π½ΠΈΠ΅ΠΌ.
ΠΠ΄Π΅ ΡΠΈΡΠ°ΡΡ ΠΊΠ½ΠΈΠ³ΠΈ
Π‘ΠΌΠ°ΡΡΡΠΎΠ½Ρ ΠΈ ΠΏΠ»Π°Π½ΡΠ΅ΡΡ
Π£ΡΡΠ°Π½ΠΎΠ²ΠΈΡΠ΅ ΠΏΡΠΈΠ»ΠΎΠΆΠ΅Π½ΠΈΠ΅ Google Play ΠΠ½ΠΈΠ³ΠΈ Π΄Π»Ρ Android ΠΈΠ»ΠΈ iPad/iPhone. ΠΠ½ΠΎ ΡΠΈΠ½Ρ
ΡΠΎΠ½ΠΈΠ·ΠΈΡΡΠ΅ΡΡΡ Ρ Π²Π°ΡΠΈΠΌ Π°ΠΊΠΊΠ°ΡΠ½ΡΠΎΠΌ Π°Π²ΡΠΎΠΌΠ°ΡΠΈΡΠ΅ΡΠΊΠΈ, ΠΈ Π²Ρ ΡΠΌΠΎΠΆΠ΅ΡΠ΅ ΡΠΈΡΠ°ΡΡ Π»ΡΠ±ΠΈΠΌΡΠ΅ ΠΊΠ½ΠΈΠ³ΠΈ ΠΎΠ½Π»Π°ΠΉΠ½ ΠΈ ΠΎΡΠ»Π°ΠΉΠ½ Π³Π΄Π΅ ΡΠ³ΠΎΠ΄Π½ΠΎ.
ΠΠΎΡΡΠ±ΡΠΊΠΈ ΠΈ Π½Π°ΡΡΠΎΠ»ΡΠ½ΡΠ΅ ΠΊΠΎΠΌΠΏΡΡΡΠ΅ΡΡ
Π‘Π»ΡΡΠ°ΠΉΡΠ΅ Π°ΡΠ΄ΠΈΠΎΠΊΠ½ΠΈΠ³ΠΈ ΠΈΠ· Google Play Π² Π²Π΅Π±-Π±ΡΠ°ΡΠ·Π΅ΡΠ΅ Π½Π° ΠΊΠΎΠΌΠΏΡΡΡΠ΅ΡΠ΅.
Π£ΡΡΡΠΎΠΉΡΡΠ²Π° Π΄Π»Ρ ΡΡΠ΅Π½ΠΈΡ ΠΊΠ½ΠΈΠ³
Π§ΡΠΎΠ±Ρ ΠΎΡΠΊΡΡΡΡ ΠΊΠ½ΠΈΠ³Ρ Π½Π° ΡΠ°ΠΊΠΎΠΌ ΡΡΡΡΠΎΠΉΡΡΠ²Π΅ Π΄Π»Ρ ΡΡΠ΅Π½ΠΈΡ, ΠΊΠ°ΠΊ Kobo, ΡΠΊΠ°ΡΠ°ΠΉΡΠ΅ ΡΠ°ΠΉΠ» ΠΈ Π΄ΠΎΠ±Π°Π²ΡΡΠ΅ Π΅Π³ΠΎ Π½Π° ΡΡΡΡΠΎΠΉΡΡΠ²ΠΎ. ΠΠΎΠ΄ΡΠΎΠ±Π½ΡΠ΅ ΠΈΠ½ΡΡΡΡΠΊΡΠΈΠΈ ΠΌΠΎΠΆΠ½ΠΎ Π½Π°ΠΉΡΠΈ Π² Π‘ΠΏΡΠ°Π²ΠΎΡΠ½ΠΎΠΌ ΡΠ΅Π½ΡΡΠ΅.
