Components, Packaging and Manufacturing Technology
Yanwen Wu
jan. 2011 · Trans Tech Publications Ltd
E-bok
870
Sider
family_home
Kvalifisert
info
reportVurderinger og anmeldelser blir ikke kontrollert Finn ut mer
Om denne e-boken
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
Vurder denne e-boken
Fortell oss hva du mener.
Hvordan lese innhold
Smarttelefoner og nettbrett
Installer Google Play Bøker-appen for Android og iPad/iPhone. Den synkroniseres automatisk med kontoen din og lar deg lese både med og uten nett – uansett hvor du er.
Datamaskiner
Du kan lytte til lydbøker du har kjøpt på Google Play, i nettleseren på datamaskinen din.
Lesebrett og andre enheter
For å lese på lesebrett som Kobo eReader må du laste ned en fil og overføre den til enheten din. Følg den detaljerte veiledningen i brukerstøtten for å overføre filene til støttede lesebrett.
