Bonding in Microsystem Technology
Jan A. Dziuban
јан 2007. · Springer Series in Advanced Microelectronics 24. књига · Springer Science & Business Media
2,0star
1 recenzijareport
E-knjiga
334
Stranica
reportOcene i recenzije nisu verifikovane Saznajte više
O ovoj e-knjizi
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
Ocene i recenzije
2,0
1 recenzija
Ocenite ovu e-knjigu
Javite nam svoje mišljenje.
Informacije o čitanju
Pametni telefoni i tableti
Instalirajte aplikaciju Google Play knjige za Android i iPad/iPhone. Automatski se sinhronizuje sa nalogom i omogućava vam da čitate onlajn i oflajn gde god da se nalazite.
Laptopovi i računari
Možete da slušate audio-knjige kupljene na Google Play-u pomoću veb-pregledača na računaru.
E-čitači i drugi uređaji
Da biste čitali na uređajima koje koriste e-mastilo, kao što su Kobo e-čitači, treba da preuzmete fajl i prenesete ga na uređaj. Pratite detaljna uputstva iz centra za pomoć da biste preneli fajlove u podržane e-čitače.
