Bonding in Microsystem Technology

ยท Springer Series in Advanced Microelectronics แƒฌแƒ˜แƒ’แƒœแƒ˜ 24 ยท Springer Science & Business Media
2,0
1 แƒ›แƒ˜แƒ›แƒแƒฎแƒ˜แƒšแƒ•แƒ
แƒ”แƒšแƒฌแƒ˜แƒ’แƒœแƒ˜
334
แƒ’แƒ•แƒ”แƒ แƒ“แƒ˜
แƒ แƒ”แƒ˜แƒขแƒ˜แƒœแƒ’แƒ”แƒ‘แƒ˜ แƒ“แƒ แƒ›แƒ˜แƒ›แƒแƒฎแƒ˜แƒšแƒ•แƒ”แƒ‘แƒ˜ แƒ“แƒแƒฃแƒ“แƒแƒกแƒขแƒฃแƒ แƒ”แƒ‘แƒ”แƒšแƒ˜แƒ ย แƒจแƒ”แƒ˜แƒขแƒงแƒ•แƒ”แƒ— แƒ›แƒ”แƒขแƒ˜

แƒแƒ› แƒ”แƒšแƒฌแƒ˜แƒ’แƒœแƒ˜แƒก แƒจแƒ”แƒกแƒแƒฎแƒ”แƒ‘

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the authorโ€™s personal experience.

แƒจแƒ”แƒคแƒแƒกแƒ”แƒ‘แƒ”แƒ‘แƒ˜ แƒ“แƒ แƒ›แƒ˜แƒ›แƒแƒฎแƒ˜แƒšแƒ•แƒ”แƒ‘แƒ˜

2,0
1 แƒ›แƒ˜แƒ›แƒแƒฎแƒ˜แƒšแƒ•แƒ

แƒจแƒ”แƒแƒคแƒแƒกแƒ”แƒ— แƒ”แƒก แƒ”แƒšแƒฌแƒ˜แƒ’แƒœแƒ˜

แƒ’แƒ•แƒ˜แƒ—แƒฎแƒแƒ แƒ˜แƒ— แƒ—แƒฅแƒ•แƒ”แƒœแƒ˜ แƒแƒ–แƒ แƒ˜.

แƒ˜แƒœแƒคแƒแƒ แƒ›แƒแƒชแƒ˜แƒ แƒฌแƒแƒ™แƒ˜แƒ—แƒฎแƒ•แƒแƒกแƒ—แƒแƒœ แƒ“แƒแƒ™แƒแƒ•แƒจแƒ˜แƒ แƒ”แƒ‘แƒ˜แƒ—

แƒกแƒ›แƒแƒ แƒขแƒคแƒแƒœแƒ”แƒ‘แƒ˜ แƒ“แƒ แƒขแƒแƒ‘แƒšแƒ”แƒขแƒ”แƒ‘แƒ˜
แƒ“แƒแƒแƒ˜แƒœแƒกแƒขแƒแƒšแƒ˜แƒ แƒ”แƒ— Google Play Books แƒแƒžแƒ˜ Android แƒ“แƒ iPad/iPhone แƒ›แƒแƒฌแƒงแƒแƒ‘แƒ˜แƒšแƒแƒ‘แƒ”แƒ‘แƒ˜แƒกแƒ—แƒ•แƒ˜แƒก. แƒ˜แƒก แƒแƒ•แƒขแƒแƒ›แƒแƒขแƒฃแƒ แƒแƒ“ แƒ’แƒแƒœแƒแƒฎแƒแƒ แƒชแƒ˜แƒ”แƒšแƒ”แƒ‘แƒก แƒกแƒ˜แƒœแƒฅแƒ แƒแƒœแƒ˜แƒ–แƒแƒชแƒ˜แƒแƒก แƒ—แƒฅแƒ•แƒ”แƒœแƒก แƒแƒœแƒ’แƒแƒ แƒ˜แƒจแƒ—แƒแƒœ แƒ“แƒ แƒกแƒแƒจแƒฃแƒแƒšแƒ”แƒ‘แƒแƒก แƒ›แƒแƒ’แƒชแƒ”แƒ›แƒ—, แƒฌแƒแƒ˜แƒ™แƒ˜แƒ—แƒฎแƒแƒ— แƒกแƒแƒกแƒฃแƒ แƒ•แƒ”แƒšแƒ˜ แƒ™แƒแƒœแƒขแƒ”แƒœแƒขแƒ˜ แƒœแƒ”แƒ‘แƒ˜แƒกแƒ›แƒ˜แƒ”แƒ  แƒแƒ“แƒ’แƒ˜แƒšแƒแƒก, แƒ แƒแƒ’แƒแƒ แƒช แƒแƒœแƒšแƒแƒ˜แƒœ, แƒ˜แƒกแƒ” แƒฎแƒแƒ–แƒ’แƒแƒ แƒ”แƒจแƒ” แƒ แƒ”แƒŸแƒ˜แƒ›แƒจแƒ˜.
แƒšแƒ”แƒžแƒขแƒแƒžแƒ”แƒ‘แƒ˜ แƒ“แƒ แƒ™แƒแƒ›แƒžแƒ˜แƒฃแƒขแƒ”แƒ แƒ”แƒ‘แƒ˜
Google Play-แƒจแƒ˜ แƒจแƒ”แƒซแƒ”แƒœแƒ˜แƒšแƒ˜ แƒแƒฃแƒ“แƒ˜แƒแƒฌแƒ˜แƒ’แƒœแƒ”แƒ‘แƒ˜แƒก แƒ›แƒแƒกแƒ›แƒ”แƒœแƒ แƒ—แƒฅแƒ•แƒ”แƒœแƒ˜ แƒ™แƒแƒ›แƒžแƒ˜แƒฃแƒขแƒ”แƒ แƒ˜แƒก แƒ•แƒ”แƒ‘-แƒ‘แƒ แƒแƒฃแƒ–แƒ”แƒ แƒ˜แƒก แƒ’แƒแƒ›แƒแƒงแƒ”แƒœแƒ”แƒ‘แƒ˜แƒ— แƒจแƒ”แƒ’แƒ˜แƒซแƒšแƒ˜แƒแƒ—.
แƒ”แƒšแƒฌแƒแƒ›แƒ™แƒ˜แƒ—แƒฎแƒ•แƒ”แƒšแƒ”แƒ‘แƒ˜ แƒ“แƒ แƒกแƒฎแƒ•แƒ แƒ›แƒแƒฌแƒงแƒแƒ‘แƒ˜แƒšแƒแƒ‘แƒ”แƒ‘แƒ˜
แƒ”แƒšแƒ”แƒฅแƒขแƒ แƒแƒœแƒฃแƒšแƒ˜ แƒ›แƒ”แƒšแƒœแƒ˜แƒก แƒ›แƒแƒฌแƒงแƒแƒ‘แƒ˜แƒšแƒแƒ‘แƒ”แƒ‘แƒ–แƒ” แƒฌแƒแƒกแƒแƒ™แƒ˜แƒ—แƒฎแƒแƒ“, แƒ แƒแƒ’แƒแƒ แƒ˜แƒชแƒแƒ Kobo eReaders, แƒ—แƒฅแƒ•แƒ”แƒœ แƒฃแƒœแƒ“แƒ แƒฉแƒแƒ›แƒแƒขแƒ•แƒ˜แƒ แƒ—แƒแƒ— แƒคแƒแƒ˜แƒšแƒ˜ แƒ“แƒ แƒ’แƒแƒ“แƒแƒ˜แƒขแƒแƒœแƒแƒ— แƒ˜แƒ’แƒ˜ แƒ—แƒฅแƒ•แƒ”แƒœแƒก แƒ›แƒแƒฌแƒงแƒแƒ‘แƒ˜แƒšแƒแƒ‘แƒแƒจแƒ˜. แƒ“แƒแƒฎแƒ›แƒแƒ แƒ”แƒ‘แƒ˜แƒก แƒชแƒ”แƒœแƒขแƒ แƒ˜แƒก แƒ“แƒ”แƒขแƒแƒšแƒฃแƒ แƒ˜ แƒ˜แƒœแƒกแƒขแƒ แƒฃแƒฅแƒชแƒ˜แƒ”แƒ‘แƒ˜แƒก แƒ›แƒ˜แƒฎแƒ”แƒ“แƒ•แƒ˜แƒ— แƒ’แƒแƒ“แƒแƒ˜แƒขแƒแƒœแƒ”แƒ— แƒคแƒแƒ˜แƒšแƒ”แƒ‘แƒ˜ แƒ›แƒฎแƒแƒ แƒ“แƒแƒญแƒ”แƒ แƒ˜แƒš แƒ”แƒšแƒฌแƒแƒ›แƒ™แƒ˜แƒ—แƒฎแƒ•แƒ”แƒšแƒ”แƒ‘แƒ–แƒ”.
แƒฃแƒ™แƒแƒœแƒแƒœแƒ แƒ™แƒแƒœแƒขแƒ”แƒœแƒขแƒ˜แƒก แƒจแƒ”แƒกแƒแƒฎแƒ”แƒ‘ แƒ›แƒแƒฎแƒกแƒ”แƒœแƒ”แƒ‘แƒ

แƒกแƒ”แƒ แƒ˜แƒ˜แƒก แƒ’แƒแƒ’แƒ แƒซแƒ”แƒšแƒ”แƒ‘แƒ

Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies
Stephan Henzler
แƒฌแƒ˜แƒ’แƒœแƒ˜ 25
108,99ย โ‚ฌ76,29ย โ‚ฌ
High-Dynamic-Range (HDR) Vision: Microelectronics, Image Processing, Computer Graphics
Bernd Hoefflinger
แƒฌแƒ˜แƒ’แƒœแƒ˜ 26โ€ขComputers en technologie
152,59ย โ‚ฌ106,81ย โ‚ฌ
Advanced Gate Stacks for High-Mobility Semiconductors
Athanasios Dimoulas
แƒฌแƒ˜แƒ’แƒœแƒ˜ 27
152,59ย โ‚ฌ106,81ย โ‚ฌ
Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Michael Fulde
แƒฌแƒ˜แƒ’แƒœแƒ˜ 28
98,09ย โ‚ฌ68,66ย โ‚ฌ

แƒ›แƒกแƒ’แƒแƒ•แƒกแƒ˜ แƒ”แƒšแƒฌแƒ˜แƒ’แƒœแƒ”แƒ‘แƒ˜

Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies
Stephan Henzler
แƒฌแƒ˜แƒ’แƒœแƒ˜ 25
108,99ย โ‚ฌ76,29ย โ‚ฌ
Cellular Neural Networks: Chaos, Complexity and VLSI Processing
Gabriele Manganaro
แƒฌแƒ˜แƒ’แƒœแƒ˜ 1โ€ขComputers en technologie
98,09ย โ‚ฌ68,66ย โ‚ฌ
Climate System Dynamics and Modelling
Hugues Goosse
62,33ย โ‚ฌ
Handbook of Contact Mechanics: Exact Solutions of Axisymmetric Contact Problems
Valentin L. Popov
0ย โ‚ฌ