Harsh Environment Electronics: Interconnect Materials and Performance Assessment
Ahmed Sharif
Apr 2019 · John Wiley & Sons
Ebook
400
Pages
reportRatings and reviews aren’t verified Learn More
About this ebook
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions
This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage.
Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.
-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics
-Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature
-Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications
-Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more
-A pivotal reference for professionals, engineers, students, and researchers
Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage.
Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.
-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics
-Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature
-Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications
-Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more
-A pivotal reference for professionals, engineers, students, and researchers
Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
About the author
Ahmed Sharif, PhD, has been working as faculty in the Department of Materials and Metallurgical Engineering at the Bangladesh University of Engineering and Technology since 1999. He is an international renowned scientist in joining technology, and has published more than fifty peer-reviewed papers in leading international journals in soldering and ferroelectric materials research. A part of his PhD research has led to the award of an international prize, the "IEEE CPMT Young Scientist Award", for his paper presentation in an IEEE conference held in Japan in 2004.
Rate this ebook
Tell us what you think.
Reading information
Smartphones and tablets
Install the Google Play Books app for Android and iPad/iPhone. It syncs automatically with your account and allows you to read online or offline wherever you are.
Laptops and computers
You can listen to audiobooks purchased on Google Play using your computer's web browser.
eReaders and other devices
To read on e-ink devices like Kobo eReaders, you'll need to download a file and transfer it to your device. Follow the detailed Help Center instructions to transfer the files to supported eReaders.
