3D and Circuit Integration of MEMS
Par šo e-grāmatu
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems
MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.
You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks.
Readers will also benefit from the inclusion of:
Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Par autoru
Masayoshi Esashi is senior research fellow in the Micro System Integration Center at Tohoku University and Professor emeritus. He obtained his doctorate from Tohoku University and his research focuses on MEMS, integrated sensors, and MEMS packaging. He has published over 500 scientific papers and was the recipient of the IEEE Jun-ichi Nishizawa Medal in 2016.
