Through-Silicon Vias for 3D Integration

Make: Electronics: Learning Through Discovery

Semiconductor Advanced Packaging

Beginner's Guide to Reading Schematics, Third Edition: Edition 3

Fan-Out Wafer-Level Packaging

Arduino: A Begineer's Guide

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Electronic Components and Circuits Lab

Chiplet Design and Heterogeneous Integration Packaging

Digital Electronics

3D IC Integration and Packaging

Practical Electronics: Components and Techniques: Components and Techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Communications Circuits Experiments

Make: Analog Synthesizers: Make Electronic Sounds the Synth-DIY Way

Assembly and Reliability of Lead-Free Solder Joints

Introduction to Oscillators

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Circuitbuilding Do-It-Yourself For Dummies

Microvias: For Low Cost, High Density Interconnects