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More by King-Ning Tu
Icon image Solder Joint Technology: Materials, Properties, and Reliability
Solder Joint Technology: Materials, Properties, and Reliability
Book 92
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Icon image Elements of Electromigration: Electromigration in 3D IC technology
Elements of Electromigration: Electromigration in 3D IC technology
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Icon image Kinetics in Nanoscale Materials: Edition 2
Kinetics in Nanoscale Materials: Edition 2
€117.99
Icon image Electronic Packaging Science and Technology
Electronic Packaging Science and Technology
€148.99
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